Ashwini Singh chandel 244102402
Internet of Things, Intenet of Everything
IOT- The internet of things refers to Network of
physical devices that are embedded with sensors, software
and other technologies to connect and exchange data with
over the internet. scope of IOT
Other devices and systems
includes. Smart homes – Devices suchas Start thermostats,
secutity systems and lightning control.
• Heathcare-ex-smart watches that monitor health data, medical
equipment connected to health care system
• Smart cities – Traffic lights, Waste management, Energy grid
Optimized by IoT data.
• Industrid IOT- Machines connected to monitor to optimize
production, maintenance, etc.
Agneulture-sensors used for precision forming monitoring
Soil conditions and managing irrigation system.
IoB-expands beyond IOT by incorporating not just devices
but also people, Data, processes and wider range of physical
objects connected to Internet-
COSC) Outside system connectivity – The main scope of this
report is OSC.
Current state- Ist devices Communicate over wide
range of Network like, LPWAN, Bluetooth, wifi, 5G network.
Data rate of Bluetooth and LPwArt is kesthon 2mbps
Mobile devices support 4G LTE and 5G with dowload rate
of upto 5Gbps and marimeum no of antennas is 13 to support GPS: 359,4
Fibre optic operate at 100Tbps. Microwave backhaul
at 400mbps.
Data centre using active optical cables (Roc) communicate
at 400Gbps.
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Drivers and technology target
For mobile cellular devices – Drivers are manimum data rate and
noof wireless antennas to support multiple wireless technologic
Power amplifiers and Alp need to have improved energy efficiency.
Data centre upgrade serverevery 3 glass. Therefore Aoc also needs
to be upgraded simultaneously. HPC for machine learning
with reduced machine to machine or machive to memorg
Latency
to
about-280-300ns.
Hardware and lo ftware solution for security of devices connecteds
to IoT.
D/A, A/D, and amplifiess magrequire Circuits basedon CMOS,
BiCMOS, Size, or Ⅲ-V. heterogerous 2,50 and 30 integration
Technologies to integrate optical devices on substrate
Suchas silicon, in packages or printed circuit boards to reduce
Size, increase speed and reduce costo
Challanges
Acheiving high performance, energy efficient RF andleg technology
Compatible with cmos for emerging high data rate applications.
Power amplifiers, APD, D/A efficiency degrade at high frequency.
CNOS gate resistance must be reduced. Size and performance
needs inereared ft and frmax. Complex anteanas need to
be developed with small form factor.
Cost of optical interconnect has to be reduced and
information density increased.
Reducing pover of opticed. Flo as data rates and I10
density increases. Using 3D printing instead of planario
White noise expected to be 30-36dB higher in 5G thankG.
So circuits needed to cancel noise.
High density RF expected to interfere with mm Wave.
Technology needed to up/down shift wavelength, change
polarization, and modulation converters
Reducing lateneg between CPV and memory or other CPU in
data Centers.
efficiency of com
Increcesing effic
667 cost effectively.
7 communicationi abone 10Gbps for
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Prediction and Roadmaps for above challanges
A
1) Data center – Spine leaf architechture to link each rack to
angother in relatively large portion of datacenter.
Multimode fibre with PAM for power and cost advantage.
HOM techniques can be adopted for high speed.
en Droposed to allow multiple seren
Breakout Cable have
to co momesnicate through a sople port switch. Photonic 2/0 to
reduce power. For low latency assigning specific wavelength to
cach se meer with router consisting of a grating to passively direct
wavelength to target server is proposed.
Adopting Silicon photonic embedded modules with optical fibre pigtails.
This Prausneciever can evolve to directly interface with optical PCB
‘r or Plasmonic Mach Zender
embedding waveguide.
de Mach zehnder
modulators may be used to reduce pover and cost.
2.) High performace computing – For quantum computing communication
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I’lebit in cryogenic system to conventional electronics, communicatio
of & cebit
Of laser light to a
eryogenic photo detector has been demonstrated.
of
1,1
–
3.) Telecommunication For FTTX optical interconnect.
Mach Zehnder Mor and Demux based on plasmonic
technology is proposed. Silicon modules and improvement in Lasers
detectors and Modulators Ceen be adopted.
4.) Optical LANM- Silicon photonic modele, high performance lasers
highly efficient modulators that enable encoding ina single
Wavelength could be evolutionary improvement. Free
spuce optical interconnect (LiFi) aproated by high data
rata LED could be used.
6.) Mobile smart phones. – MIMO at frequency & 6GHz or mmware
“that require multiple antennas into: phone. To improve
ADL/DAC efficiency. concept have been demostrated that
furn on converters only when processing data with f’bit
accuracy
and consumes 15ilmba Power.
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In long term mm Wave may be used in high popcdation
density area to support high data rate, Building need to have
repeatere since 289 Hz to 189H2 donat penetrate buildings.
fligh performance incumbent process orenen new malesise to
Omprove efficiencicies of power amplifiers.
Autonomus vehicles – As more vehicles become autonomous
enormous wireless data needs to be handled. 56 data rate
with massive MIMO.or mm Wane could be used. Both method
could have directional antenna with fracking of pase Station
location to reduce, risk of spoofing and evesdropping plastic
optical fibre car is used for entertainment at 150 Mbps
7) Aerospace – Flying drone-like.
ane
being developed to provide
Internet access with RF overlange areas Like anees.
Struck by earthquake, typhoons, hurricanes, floods etc.
Frue space optical interconnect are
being proposed to
provide communication, internet caccess and entertainment
to passengers.
8.) Medical and health devices – Implanted medical device, communicatny
with RF 175kz and 402-405MHz, which is secure, consumes
low power and
I highly reliable to is on the wagh. Emerging response
evaluating communication of patient redio (1.5-39bs) to
unit are eva
nearby hospital to enable them to assist patient condition.
Roadmap
Ic for RF-RF Ams performace metric for
to peak ft, gum for 28, 22,16nm nodes.
cmos have been restricted
Group IV Bipodos – PT, B, VCEO, BO, Jcat peak fr, defimin, We data
have been shifted by
one year.
II-V FET Bipolar – Increcesing &T, Imaneyain
Photonic I C
Recent develop mert in following domain is predicted
Photonic Monolithic hetrogenous I C
Low power high output Laser.
Yow power modulator
@Electro absorption modulator
Wannier-Stark localisation
⑨ Compact Mux Derlex
10
wave geide
Bulk semiconductor fsarz-Keldysh effect(IIT-VGE)
plasmonic modulators
Stark effect.
High speed high density
photo detector
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